Nexperia
BUK9605-30A
N-channel TrenchMOS logic level FET
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to
mounting base
thermal resistance from junction to Minimum footprint ; FR4 board
ambient
Min Typ Max Unit
-
-
0.65 K/W
-
50
-
K/W
1
Zth(j-mb)
(K/W)
10-1
δ = 0.5
0.2
0.1
0.05
0.02
10-2
0
003aag054
P
tp
δ=
T
10-3
10-6
10-5
10-4
10-3
10-2
tp
T
10-1
t
1 10
tp (s)
Fig 5. Transient thermal impedance from junction to mounting base as a function of pulse duration
BUK9605-30A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 19 April 2011
© Nexperia B.V. 2017. All rights reserved
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