CP305-2N3019 View Datasheet(PDF) - Central Semiconductor

Part Name

Description

Manufacturer

CP305-2N3019

Small Signal Transistor NPN - High Current Transistor Chip

Central Semiconductor 

PROCESS CP305

Small Signal Transistor

NPN - High Current Transistor Chip

PROCESS DETAILS

Process

Die Size

Die Thickness

Base Bonding Pad Area

Emitter Bonding Pad Area

Top Side Metalization

Back Side Metalization

GEOMETRY

EPITAXIAL PLANAR

31 x 31 MILS

9.0 MILS

5.9 x 11.8 MILS

6.5 x 13.8 MILS

Al - 30,000Å

Au - 18,000Å

GROSS DIE PER 4 INCH WAFER

11,212

PRINCIPAL DEVICE TYPES

2N3019

CMPT3019

CXT3019

CZT3019

w w w. c e n t r a l s e m i . c o m

R3 (22-March 2010)

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