DL4001 THRU DL4007
SURFACE MOUNT RECTIFIERS
REVERSE VOLTAGE: 50 - 1000 V CURRENT: 1.0 A
DO - 213AB
SOLDERABLE ENDS
D2=D1
+0
-0.20
FEATURES
◇ Glass passivated device
◇ Ideal for surface mouted applications
◇ Low leakage current
◇ Metallurgically bonded construction
D2
0.5± 0.1
4.9± 0.2
0.5± 0.1
Dimensions in millimeters
MECHANICAL DATA
◇ Case:JEDEC DO-213AB,molded plastic over
passivated chip
◇ Terminals:Solder Plated, solderable per
MIL-STD-750, Method 2026
◇ Polarity: Color band denotes cathode end
◇ Weight: 0.0046 ounces, 0.116 gram
◇ Mounting position: Any
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase,half wave,60Hz,resistive or inductive load.For capactive load,derate current by 20%.
MDD Catalog Number
DL DL DL DL DL
4001 4002 4003 4004 4005
Maximum recurrent peak reverse voltage VRRM 50
100
200
400
600
Maximum RMS voltage
VRMS 35
70
140 280 420
Maximum DC blocking voltage
VDC 50 100 200 400 600
Maximum average forword
rectified current TA=75℃
I(AV)
1.0
Peak forward surge current 8.3ms single
half-sine-wave superimposed
IFSM
30
on rated load (JEDEC method)
Maximum forward voltage at 1.0A
VF
Maximum DC reverse current @TA=25℃
at rated DC blockjing voltage @TA=125℃
IR
Typical junction capacitance (NOTE 1)
Cj
Typical thermal resistance (NOTE 2)
RjθL
Typical thermal resistance (NOTE 3)
RjθA
Operating temperature range
Tj
Storage temperature range
TSTG
1.1
5.0
50
15
20
50
- 55 --- + 175
- 55 --- + 175
NOTES:1. Measured at 1.0MHz and applied average voltage of 4.0V DC.
2. Thermal resistance junction to lead, 6.0 mm 2 coppeer pads to each terminal.
3. Thermal resistance junction to ambient, 6.0 mm 2 coppeer pads to each terminal.
DL
4006
800
560
800
DL UNITS
4007
1000 V
700
V
1000 V
A
A
V
μA
pF
℃/W
℃/W
℃
℃