HLMP-CM27-X10XX View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
Manufacturer
HLMP-CM27-X10XX
HP => Agilent Technologies
HLMP-CM27-X10XX Datasheet PDF : 9 Pages
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Package Dimensions
Package A
1.14 ± 0.20
(0.045 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
NOTE 1
8.71 ± 0.20
(0.343 ± 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
CATHODE
LEAD
31.60
(1.244)
MIN.
∅
5.80
(0.228
±
±
0.20
0.008)
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
2.54 ± 0.38
(0.100 ± 0.015)
(01.0.0309) MIN.
CATHODE
FLAT
Package B
1.14 ± 0.20
(0.045 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
NOTE 1
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
8.71 ± 0.20
(0.343 ± 0.008)
DIMENSION H
(REFER TO TABLE BELOW)
31.60
(1.244)
MIN.
CATHODE
LEAD
DIMENSION H:
15° = 11.40 ± 0.25 mm (0.449 ± 0.01 INCH)
23° = 11.85 ± 0.25 mm (0.467 ± 0.01 INCH)
30° = 11.50 ± 0.25 mm (0.453 ± 0.01 INCH)
NOTES:
1. MEASURED JUST ABOVE FLANGE.
2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.
∅(05.2.8208
±
±
0.20
0.008)
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
2.54 ± 0.38
(0.100 ± 0.015)
1.00
(0.039)
MIN.
CATHODE
FLAT
2
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