SM110G View Datasheet(PDF) - NEC => Renesas Technology
Part Name
Description
Manufacturer
SM110G
NEC => Renesas Technology
SM110G Datasheet PDF : 8 Pages
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SM/G SERIES
q The body temperature of the thermal cutoff becomes higher as current passes through and might rise higher
than the ambient operating temperature (see test data). The temperature may rise even higher depending on
the mounting method and other conditions. Therefore, after mounting the thermal cutoff under the same
conditions you would use for the actual application, work the final product and measure the body temperature
of the thermal cutoff.
q Use the thermal cutoff with a voltage and current level lower than the rated level.
If the thermal cutoff is used with a voltage or current level higher than the rated level, the body of the thermal
cutoff may be destroyed.
q Do not use the thermal cutoff in water, organic solvents or other liquids, or environments containing sulfurous
acid gas, nitrous acid gas, or high humidity. Doing so will cause deterioration of the sealing resin, the thermal
cutoff may operate at lower than operating temperatures, or any other malfunctions may occur. Also, the
thermal cutoff may not operate even if its operating temperature is exceeded.
Lead wire process
q When bending the lead wire, in order to protect the resin seal from excessive pressure, secure the lead wire
cIose to the case and bend the part beyond the secured section,
3 mm or more
Secured
Secured
The lead wire should be bent at a distance 3 mm or more from the body of the fuse, and should not be twisted.
q The tensile strength applied to the lead wire should be 1kg or less for the SM type thermal cutoff.
q The strength applied to the body of the thermal cutoff should be 5 kg or less for the SM type thermal cutoff.
5 kgf max.
φ 0.8 steel wire
Mounting
SEFUSE can be mounted by soldering, caulking, or welding.
q If soldering, note that the thermal cutoff may not function because of excessive solder temperature.
To prevent such malfunctions, for example, holding the lead near the case by a tool is effective for allowing
the heat to escape, and the soldering should be done in short interval.
Another effective method is to use a lower solder temperature and to solder at a location that is distant from
the case.
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