MAX803(2006) View Datasheet(PDF) - ON Semiconductor

Part Name

Description

Manufacturer

MAX803
(Rev.:2006)

Very Low Supply Current 3−Pin Microprocessor Reset Monitor

ON Semiconductor 

MAX803 Series, NCP803 Series

PACKAGE DIMENSIONS

E

A

A1

D

3

1

2

e

SOT−23 (TO236)

CASE 318−08

ISSUE AN

SEE VIEW C

HE

b

c

0.25

q

L

L1

VIEW C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW

STANDARD 318−08.

MILLIMETERS

DIM MIN

NOM MAX

A 0.89

1.00

1.11

A1 0.01

0.06

0.10

b 0.37

0.44

0.50

c

0.09

0.13

0.18

D 2.80

2.90

3.04

E 1.20

1.30

1.40

e

1.78

1.90

2.04

L 0.10

0.20

0.30

L1 0.35

0.54

0.69

H E 2.10

2.40

2.64

MIN

0.035

0.001

0.015

0.003

0.110

0.047

0.070

0.004

0.014

0.083

INCHES

NOM

0.040

0.002

0.018

0.005

0.114

0.051

0.075

0.008

0.021

0.094

MAX

0.044

0.004

0.020

0.007

0.120

0.055

0.081

0.012

0.029

0.104

SOLDERING FOOTPRINT*

0.95

0.037

0.95

0.037

0.9

0.035

2.0

0.079

0.8

0.031

ǒ Ǔ SCALE 10:1

mm

inches

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

8

Share Link: