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MC13156DW View Datasheet(PDF) - LANSDALE Semiconductor Inc.

Part Name
Description
Manufacturer
MC13156DW
LANSDALE
LANSDALE Semiconductor Inc. LANSDALE
MC13156DW Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
ML13156
LANSDALE Semiconductor, Inc.
BER TESTING AND PERORMANCE
DESCRIPTION
The test setup shown in Figure 29 is configured so that the function
generator supplies a 100 kHz clock source to the bit error rate
tester. This device generates and receives a repeating data pattern
and drives a 5 pole baseband data filter. The filter effectively
reduces harmonic content of the base band data which is used to
modulate the RF generator which is running at 144.45 MHz.
Following processing of the signal by the receiver (ML13156), the
recovered baseband sinewave (data) is AC coupled to the data
slicer. The data slicer is essentially an auto–threshold comparator
which tracks the zero crossing of the incoming sinewave and pro-
vides logic level data at its output. Data errors associated with the
recovered data are collected by the bit error rate receiver and dis-
played.
Bit error rate versus RF signal input level and IF filter bandwidth
are shown in Figure 28. The bit error rate data was taken under the
following test conditions:
• Data rate = 100kbps
• Filter cutoff frequency set to 39% of the data rate or 39 kHz.
• Filter type is a 5 pole equal–ripple with 0.5° phase error.
• VCC = 4.0 Vdc
• Frequency deviation = ±32 kHz.
Figure 28. Bit Error Rate versus RF
Input Signal Level and IF Bandpass Filter
10 –1
10 –3
IF Filter BW
110 kHz
VCC = 4.0 Vdc
Data Pattern = 2E09 Prbs NRZ
Baseband Filter fc = 50 kHz
fdev = ±32 kHz
10 –5
IF Filter BW
230 kHz
10 –7
–90
–85
–80
–75
–70
RF INPUT SIGNAL LEVEL (dBm)
EVALUATION PC BOARD
The evaluation PCB is very versatile and is intended to be used
across the entire useful frequency range of this device. The center
section of the board provides an area for attaching all SMT compo-
nents to the component ground side (see Figures 32 and 33).
Additionally, the peripheral area surrounding the RF core provides
pads to add supporting and interface circuitry as a particular appli-
cation dictates
Page 18 of 21
www.lansdale.com
Issue A

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