MC13156DW View Datasheet(PDF) - LANSDALE Semiconductor Inc.
Part Name
Description
Manufacturer
MC13156DW Datasheet PDF : 21 Pages
| |||
ML13156
LANSDALE Semiconductor, Inc.
24
1
–T–
SEATING
PLANE
OUTLINE DIMENSIONS
PLASTIC PACKAGE
(ML13156-6P)
CASE 751E–04
(SO–24L)
ISSUE E
–A–
24X D
0.010 (0.25) M T A S
22X G
13
–B– 12X P
0.010 (0.25) M B M
12
J
BS
F
C
M
K
R X 45°
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 15.25 15.54 0.601 0.612
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G
1.27 BSC
0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M
0° 8°
0° 8°
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
Page 21 of 21
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