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R8008ANX View Datasheet(PDF) - ROHM Semiconductor

Part Name
Description
Manufacturer
R8008ANX
ROHM
ROHM Semiconductor ROHM
R8008ANX Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
R8008ANX
          
                Datasheet
lAbsolute maximum ratings
Parameter
Symbol
Conditions
Values Unit
Drain - Source voltage slope
VDS = 640V, ID = 8A
dv/dt
Tj = 125
50 V/ns
lThermal resistance
Parameter
 
Symbol
for                                  
Values
Unit
Min. Typ. Max.
Thermal resistance, junction - case
Thermal resistance, junction - ambient
d Soldering temperature, wavesoldering for 10s
RthJC
RthJA
Tsold
-
- 1.87
-
- 70
-
- 265
endens lElectrical characteristics (Ta = 25°C)
m ig Parameter
Symbol
Conditions
s Drain - Source breakdown
m voltage
o e Drain - Source avalanche
D breakdown voltage
ec w Zero gate voltage
drain current
R e Gate - Source leakage current
t N Gate threshold voltage
No Static drain - source
on - state resistance
V(BR)DSS VGS = 0V, ID = 1mA
V(BR)DS VGS = 0V, ID = 4A
VDS = 800V, VGS = 0V
IDSS Tj = 25°C
Tj = 125°C
IGSS VGS = ±30V, VDS = 0V
VGS(th) VDS = 10V, ID = 1mA
VGS = 10V, ID = 4.0A
RDS(on)*6 Tj = 25°C
Values
Min. Typ. Max.
800 -
-
- 900 -
 
 
 
- 0.1 100
-
- 1000
-
- ±100
3
-
5
 
 
 
- 0.79 1.03
/W
/W
Unit
V
V
μA
nA
V
Ω
Tj = 125°C
- 1.54 -
Gate resistance
RG f = 1MHz, open drain
- 6.6 - Ω
                                                                                         
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© 2016 ROHM Co., Ltd. All rights reserved.
2/13
20160324 - Rev.002

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