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SC613EVB View Datasheet(PDF) - Semtech Corporation

Part Name
Description
Manufacturer
SC613EVB Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
POWER MANAGEMENT
Applications Information (cont.)
Table 2 -Ripple Performance
T
A
=
25°C,
Cin=Cout=Cbucket
=
1.0µF
(ESR
=
0.1)
Ouput Ripple
VOUT
Freq.
[kHz]
[mVp-p]
at 100mA and
Vin= 3.2V to 5.5V
262
25
5.0V
650
15
262
25
4.5V
650
15
Calculating Power Dissipation
The power dissipated by the SC613 is calculated as,
P D = P IN P OUT
( ) P D = V IN 2I O + I Q V O I O
Short Circuit and Over Temperature Protection
The output is current limited to 600mA to protect against short
circuit conditions. Over temperature protection is also provided.
Design and Layout Considerations
The center pad “thermal slug” is not internally connected to ground,
but should be connected to ground in the layout through vias con-
necting to the ground plane. Pin 8 can be routed directly to the
center pad. A good ground plane connection is important to make
effective use of the low thermal resistance of the MLP package.
Short Circuit and Over Temperature Protection
The output is current limited to 600mA to protect against short
circuit conditions. Over temperature protection is also provided.
Design and Layout Considerations
The center pad “thermal slug” is not internally connected to ground,
but should be connected to ground in the layout through vias con-
necting to the ground plane. Pin 8 can be routed directly to the
center pad. A good ground plane connection is important to make
effective use of the low thermal resistance of the MLP package.
2005 Semtech Corp.
6
SC613
www.semtech.com

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