TE28F800C3BA90 View Datasheet(PDF) - Intel

Part Name

Description

Manufacturer

TE28F800C3BA90

Intel Advanced+ Boot Block Flash Memory (C3)

Intel 

Intel£ Advanced+ Boot Block Flash Memory (C3)

Figure 21. Easy BGA Package Drawing & Dimension

Ball A1

Corner

D

Ball A1

S1

Corner

12 3 4 5 6 7 8

8 7 6 5 4 3 21

S2

A

A

B

B

C

C

D

D

b

E

E

E

F

F

G

G

e

H

H

Top View - Ball side down

Bottom View - Ball Side Up

A1

A2

Side View

A

Seating

Plane

Y

Note: Drawing not to scale

Dimensions Table

Package Height

Ball Height

Package Body Thickness

Ball (Lead) Width

Package Body Width

Package Body Length

Pitch

Ball (Lead) Count

Seating Plane Coplanarity

Corner to Ball A1 Distance Along D

Corner to Ball A1 Distance Along E

Millimeters

Symbol Min Nom

A

A1 0.250

A2

0.780

b

0.330 0.430

D

9.900 10.000

E 12.900 13.000

[e]

1.000

N

64

Y

S1

1.400 1.500

S2

2.900 3.000

Max

1.200

Notes

Inches

Min

0.0098

0.530

0.0130

10.100 1 0.3898

13.100 1 0.5079

0.100

1.600 1 0.0551

3.100 1 0.1142

Note: (1) Package dimensions are for reference only. These dimensions are estimates based

on die size, and are subject to change.

Nom

0.0307

0.0169

0.3937

0.5118

0.0394

64

0.0591

0.1181

Max

0.0472

0.0209

0.3976

0.5157

0.0039

0.0630

0.1220

66

Datasheet

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