ZL60102(2004) View Datasheet(PDF) - Zarlink Semiconductor Inc
Part Name
Description
Manufacturer
ZL60102
(Rev.:2004)
(Rev.:2004)
Zarlink Semiconductor Inc
ZL60102 Datasheet PDF : 20 Pages
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ZL60101/2
Data Sheet
Thermal Characteristics
There are three options for heat sinks depending on the cooling needs. They are:
1. Direct application without any attached external heat sink
2. Use a generic heat sink specified by Zarlink
3. Use a customer designed external heat sink
In Figure 11 and Figure 12, the temperature rise and thermal resistance as a function of air velocity (free air velocity
at the top of the module) is shown for option 1 and 2. The thermal resistance is defined as the temperature
difference between the case temperature and ambient flowing air divided by the total heat dissipation of the
module.
Improved thermal properties can be achieved by using a larger heat sink especially if more height is available
(option 3). For this option, a more detailed discussion with Zarlink is recommended regarding heat sink design
attachment materials.
Tem perature rise at 1.5W
(Free stream air velocity)
20
16
12
Option ZL6010*/ML
8
Option ZL6010*/MJ
4
0
0
1
2
3
4
Air velocity (m/s)
Figure 11 - Temperature Difference Between Ambient Flowing Air and Case at a Heat Dissipation
of 1.5 W
15
10
5
0
0
Therm al resistance to air
(Free stream air velocity)
1
2
3
4
Air velocity (m/s)
Option ZL6010*/ML
Option ZL6010*/MJ
Figure 12 - Thermal Resistance, as a Function of Air Velocity (the airflow is along the shortest
side of the module)
For any other orientation, the thermal resistance is 75-100% of the values shown above.
14
Zarlink Semiconductor Inc.
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