IRFR/U9120N
Electrical Characteristics @ TJ = 25ยฐC (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
โV(BR)DSS/โTJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
gfs
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
-100 โโโ โโโ V VGS = 0V, ID = -250ยตA
โโโ -0.11 โโโ V/ยฐC Reference to 25ยฐC, ID = -1mA
โโโ โโโ 0.48 โฆ VGS = -10V, ID = -3.9A ย
-2.0 โโโ -4.0 V VDS = VGS, ID = -250ยตA
1.4 โโโ โโโ S VDS = -50V, ID = -4.0Aย
โโโ โโโ -25 ยตA VDS = -100V, VGS = 0V
โโโ โโโ -250
VDS = -80V, VGS = 0V, TJ = 150ยฐC
โโโ โโโ 100 nA VGS = 20V
โโโ โโโ -100
VGS = -20V
โโโ โโโ 27
ID = -4.0A
โโโ โโโ 5.0
โโโ โโโ 15
nC VDS = -80V
VGS = -10V, See Fig. 6 and 13 ยย
โโโ 14 โโโ
VDD = -50V
โโโ 47 โโโ ns ID = -4.0A
โโโ 28 โโโ
RG = 12 โฆ
โโโ 31 โโโ
RD =12 โฆ, See Fig. 10 ยย
Between lead,
D
โโโ 4.5 โโโ
6mm (0.25in.)
nH
from package
G
โโโ 7.5 โโโ
and center of die contactย
S
โโโ 350 โโโ
VGS = 0V
โโโ 110 โโโ pF VDS = -25V
โโโ 70 โโโ
ฦ = 1.0MHz, See Fig. 5ย
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) ย
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
โโโ โโโ -6.6 A showing the
integral reverse
G
โโโ โโโ -26
p-n junction diode.
S
โโโ โโโ -1.6 V TJ = 25ยฐC, IS = -3.9A, VGS = 0V ย
โโโ 100 150 ns TJ = 25ยฐC, IF = -4.0A
โโโ 420 630 nC di/dt = 100A/ยตs ยย
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
ย Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
ย Starting TJ = 25ยฐC, L = 13mH
RG = 25โฆ, IAS = -3.9A. (See Figure 12)
ย ISD โค -4.0A, di/dt โค 300A/ยตs, VDD โค V(BR)DSS,
TJ โค 150ยฐC
ย Pulse width โค 300ยตs; duty cycle โค 2%.
ย
This is applied for I-PAK, LS of D-PAK is measured between
lead and center of die contact
ย Uses IRF9520N data and test conditions.
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994