HCPL-2602-500 View Datasheet(PDF) - HP => Agilent Technologies

Part Name

Description

Manufacturer

HCPL-2602-500

High CMR Line Receiver Optocouplers

HP => Agilent Technologies 

Solder Reflow Temperature Profile (Gull Wing Surface Mount Option 300 Parts)

260

240

220

200

180

160

140

120

100

80

60

40

20

0

0

∆T = 115°C, 0.3°C/SEC

∆T = 100°C, 1.5°C/SEC

1 23

45678

TIME – MINUTES

∆T = 145°C, 1°C/SEC

9 10 11 12

Note: Use of nonchlorine activated fluxes is highly recommended.

Regulatory Information

The HCPL-2602/2612 have been

approved by the following

organizations:

UL

Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

Insulation and Safety Related Specifications

Parameter

Min. External Air Gap

(External Clearance)

Min. External Tracking

Path (External Creepage)

Min. Internal Plastic

Gap (Internal Clearance)

Symbol

L(I01)

L(I02)

Tracking Resistance

CTI

(Comparative Tracking

Index)

Isolation Group

Value

7.1

7.4

0.08

200

Units

mm

mm

mm

V

Conditions

Measured from input terminals to output terminals,

shortest distance through air.

Measured from input terminals to output terminals,

shortest distance path along body.

Through insulation distance, conductor to conductor,

usually the direct distance between the photoemitter

and photodetector inside the optocoupler cavity.

DIN IEC 112/VDE 0303 Part 1

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

1-318

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