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RMPA29200 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
Manufacturer
RMPA29200
Fairchild
Fairchild Semiconductor Fairchild
RMPA29200 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
2 MIL GAP
5 MIL THICK
ALUMINA
50
RF INPUT
DIE-ATTACH
80Au/20Sn
5 MIL THICK
ALUMINA
50
RF OUTPUT
100pF
100pF
100pF
100pF
L < 0.015"
(4 Places)
0.01µF
0.01µF
0.01µF
0.01µF
Vg (NEGATIVE)
Vd (POSITIVE)
MMIC has Vg and Vd bias pads accessible on both top and bottom sides. DC bias connections are required only on one side.
Note:
Use 0.003" by 0.0005" gold ribbon or 1 mil gold wire for bonding. RF input and output bonds should be less than 0.015" long
with stress relief.
Figure 4. Recommended Assembly and Bonding Diagram
©2004 Fairchild Semiconductor Corporation
RMPA29200 Rev. D

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