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HLMP-CM27-X10DD View Datasheet(PDF) - Unspecified

Part Name
Description
Manufacturer
HLMP-CM27-X10DD Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Recommended Wave Soldering Profile
250
200
150
100
50
30
0
TURBULENT WAVE
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
FLUXING
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C ± 5°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5% Sn; 3% Ag; 0.5% Cu
PREHEAT
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
Ammo Packs Drawing
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
CATHODE
9.125 ± 0.625
(0.3593 ± 0.0246)
18.00 ± 0.50
(0.7087 ± 0.0197)
20.50 ± 1.00
(0.807 ± 0.039)
12.70 ± 0.30
(0.50 ± 0.0118)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
0.70 ± 0.20
(0.0276 ± 0.0079)
A
A
VIEW A–A
(0.145.0705±±00.2.0008) TYP.
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
10

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