HLMP-CB18 View Datasheet(PDF) - Avago Technologies
Part Name
Description
Manufacturer
HLMP-CB18 Datasheet PDF : 9 Pages
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Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommendedsolderingcondition:
Manual Solder
Wave Soldering Dipping
Pre-heat temperature 105 °C Max.
−
Preheat time
30 sec Max
−
Peak temperature 250 °C Max. 260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Recommended Wave Soldering Profile
TURBULENT WAVE
250
• Wave soldering parameter must be set and
maintain according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering
profile to ensure the soldering profile used is
always conforming to recommended soldering
condition.
• If necessary, use fixture to hold the LED
component in proper orientation with respect to
the PCB during soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when
heated. Therefore, the soldered PCB must be
allowed to cool to room temperature, 25°C before
handling.
• Special attention must be given to board
fabrication, solder masking, surface plating and
lead holes size and component orientation to
assure solderability.
• Recommended PC board plated through holes size
for LED component leads.
LED component
ead size
0.457 x 0.457mm
(0.018 x 0.018inch)
0.508 x 0.508mm
(0.020 x 0.020inch)
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated through
hole diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
LAMINAR WAVE
HOT AIR KNIFE
200
150
100
50
30
0
8
FLUXING
PREHEAT
10
20
30
40
50
60
TIME - SECONDS
70
80
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
90
100
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