SM6HT View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
SM6HT Datasheet PDF : 9 Pages
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Characteristics
SM6HT
Figure 7.
Variation of thermal impedance Figure 8.
junction to ambient versus pulse
duration (Printed circuit board FR4
with recommended pad layout)
Thermal resistance junction to
ambient versus copper surface
under each lead (printed circuit
board FR4, eCu = 35 µm)
100.0
Zth(j-a)(°C/W)
Recommended pad layout
Rth(j-a)(°C/W)
110
100
90
80
10.0
70
60
50
40
1.0
30
20
0.1
1.0E-03
1.0E-02
1.0E-01
tp(ms)
1.0E+00 1.0E+01 1.0E+02 1.0E+03
10
S(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
ct(s) Figure 9.
Variation of leakage current versus
junction temperature (typical
values)
du IR(µA)
ro 1.0E+00
VR = VRM
- Obsolete P Tj(°C)
) 1.0E-01
Obsolete Product(s 25
50
75
100
125
150
175
4/8
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