LQH32DN1R0M53L View Datasheet(PDF) - Unspecified
Part Name
Description
Manufacturer
LQH32DN1R0M53L Datasheet PDF : 7 Pages
| |||
SpecNo.JELF243A-0118A-01
Reference Only
P5/7
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Reflow Soldering ∗
5.5
1.0 1.3 1.0
(in mm)
11.2 Flux, Solder
・Use rosin-based flux.
Flux ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
Solder
・Use Sn-3.0Ag-0.5Cu solder
・Standard thickness of solder paste : 200μm to 300μm
Other flux (except above) Please contact us for details, then use.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
Soldering profile
Temp.
(℃)
180
150
245℃±3℃
220℃
260℃
230℃
Limit Profile
30s～60s
Standard Profile
90s±30s
60s max.
Time.(s)
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
Limit Profile
150～180°C 、90s±30s
above 220°C、30s～60s above 230°C、60s max.
245±3°C
260°C
2 times
2 times
MURATA MFG.CO., LTD
Share Link: 