MPC2605ZP66R View Datasheet(PDF) - Motorola => Freescale

Part Name

Description

Manufacturer

MPC2605ZP66R

Integrated Secondary Cache for PowerPC Microprocessors

Motorola => Freescale 

Pin Locations

Pin Name

Type

Description

2R

TRST

I

Test reset input for IEEE 1149.1 boundary scan (JTAG). If JTAG will not be used,

TRST should be tied low.

3L

TS

I/O Transfer start I/O from processor bus (can also come from any bus master on the

processor bus). Signals the start of either a processor or bus master cycle.

17F – 19F *

TSIZ0 – TSIZ2 I/O Transfer size I/O from processor bus.

1K, 2K, 1L, 2L, 1M *

TT0 – TT4

I/O Transfer type I/O from processor bus.

3H

WT

I/O Write through status input from processor bus. When tied to ground, the

MPC2605 will operate in write–through mode only (no copy–back).

4C, 15C, 16C, 9D – 11D,

8H – 10H, 4J, 8J, 9J, 16J, 4K,

8K, 12K, 16K, 4L, 11L, 12L,

16L, 10M – 12M, 3T, 9T – 11T,

17T, 3U, 4U, 15U, 17U

VDD

Supply Power supply: 3.3 V ± 5%.

7C, 9C, 13C, 14C, 7D, 8D,

12D, 13D, 4G, 16G – 18G,

4H, 11H, 12H, 16H, 10J – 12J,

9K – 11K, 8L – 10L, 4M,

8M, 9M, 16M, 4N, 16N, 7T, 8T,

12T, 13T, 5U – 7U, 12U – 14U

VSS

Supply Ground.

3F, 3R

NC

— No connection: There is no connection to the chip.

* See pin diagram (page 2) for specific pin assignment of these bus signals.

ABSOLUTE MAXIMUM RATINGS (See Note 1)

Rating

Symbol

Value

Unit

Power Supply Voltage

VDD

– 0.5 to + 4.6

V

Voltage Relative to VSS

Vin, Vout – 0.5 to VDD + 0.5 V

Output Current (per I/O)

Iout

± 20

mA

Power Dissipation (Note 2)

PD

—

W

Temperature Under Bias

Tbias

– 10 to + 85

°C

Operating Temperature

TJ

0 to + 125

°C

Storage Temperature

Tstg

– 55 to + 125

°C

NOTES:

1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are

exceeded. Functional operation should be restricted to RECOMMENDED OPER-

ATING CONDITIONS. Exposure to higher than recommended voltages for extended

periods of time could affect device reliability.

2. Power dissipation capability is dependent upon package characteristics and use

environment. See Package Thermal Characteristics.

This device contains circuitry to protect the

inputs against damage due to high static volt-

ages or electric fields; however, it is advised

that normal precautions be taken to avoid

application of any voltage higher than maxi-

mum rated voltages to this high–impedance

circuit.

This BiCMOS memory circuit has been de-

signed to meet the dc and ac specifications

shown in the tables, after thermal equilibrium

has been established.

MOTOROLA

MPC2605

5

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