NT256D72S89AKGU View Datasheet(PDF) - Unspecified

Part Name

Description

Manufacturer

NT256D72S89AKGU

256MB : 32M x 72 Low Profile Registered DDR SDRAM DIMM

Unspecified 

NT256D72S89AKGU

256MB : 32M x 72

Low Profile Registered DDR SDRAM DIMM

Input/Output Functional Description

Symbol

CK0

CK0

CKE0

S0

RAS, CAS, WE

VREF

VDDQ

BA0, BA1

A0 - A9

A10/AP

A11, A12

DQ0 - DQ63,

DQ0 – DQ63

CB0 – CB7

VDD, VSS

DQS0 – DQS17

RESET

SA0 – SA2

SDA

SCL

V DDSPD

Type Polarity

Function

(SSTL)

The positive line of the differential pair of system clock inputs which drives the input to

Positive

the on-DIMM PLL. All the DDR SDRAM address and control inputs are sampled on the

Edge

rising edge of their associated clocks.

Negative The negative line of the differential pair of system clock inputs which drives the input to

(SSTL)

Edge the on-DIMM PLL.

(SSTL)

Activates the SDRAM CK signal when high and deactivates the CK signal when low. By

Active

High deactivating the clocks, CKE low initiates the Power Down mode, or the Self Refresh

mode.

Enables the associated SDRAM command decoder when low and disables the

(SSTL)

Active command

Low decoder when high. When the command decoder is disabled, new commands are

ignored but previous operations continue.

(SSTL)

Active When sampled at the positive rising edge of the clock, RAS, CAS, WE define the

Low operation to be executed by the SDRAM.

Supply

Reference voltage for SSTL-2 inputs

Supply

Isolated power supply for the DDR SDRAM output buffers to provide improved noise

immunity

(SSTL)

- Selects which SDRAM bank is to be active.

During a Bank Activate command cycle, A0-A12 defines the row address (RA0-RA12)

when sampled at the rising clock edge.

During a Read or Write command cycle, A0-A9, A11 defines the column address

(CA0-CA10) when sampled at the rising clock edge. In addition to the column address,

(SSTL)

AP is used to invoke Autoprecharge operation at the end of the Burst Read or Write

- cycle. If AP is high, autoprecharge is selected and BA0/BA1 define the bank to be

precharged. If AP is low, autoprecharge is disabled.

During a Precharge command cycle, AP is used in conjunction with BA0/BA1 to control

which bank(s) to precharge. If AP is high all 4 banks will be precharged regardless of the

state of BA0/BA1. If AP is low, then BA0/BA1 are used to define which bank to

pre-charge.

(SSTL)

- Data and Check Bit input/output pins operate in the same manner as on conventional

DRAMs.

(SSTL)

Active Data and Check Bit Input/Output pins. Check bits are only applicable on the x72 DIMM

High configurations.

Supply

Power and ground for the DDR SDRAM input buffers and core logic

Negative

and

(SSTL) Positive Data strobe for input and output data

Edge

(LVC-MOS)

Active

Low

-

Address inputs. Connected to either VDD or VSS on the system board to configure the

Serial Presence Detect EEPROM address.

- This bi-directional pin is used to transfer data into or out of the SPD EEPROM. A resistor

must be connected from the SDA bus line to V DD to act as a pullup.

Supply

- This signal is used to clock data into and out of the SPD EEPROM. A resistor may be

connected from the SCL bus time to V DD to act as a pullup.

Serial EEPROM positive power supply.

REV 0.2 (Preliminary)

09/2002

3

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NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.

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