STPS40M60CR View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS40M60CR Datasheet PDF : 10 Pages
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STPS40M60C
Characteristics
Figure 10. Forward voltage drop versus
forward current (per diode, low
level)
IFM(A)
40
Figure 11. Forward voltage drop versus
forward current (per diode, high
level)
IFM(A)
1000.0
35
Tj=125°C
(Maximum values)
Tj=125°C
(Maximum values)
30
100.0
25
Tj=125°C
(Typical values)
20
10.0
Tj=125°C
(Typical values)
Tj=25°C
(Maximum values)
15
Tj=25°C
10
(Maximum values)
1.0
5
VFM(V)
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
VFM(V)
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab for D2PAK
Rth(j-a)(°C/W)
80
70
Epoxy printed board FR4
copper thickness = 35 µm
D2PAK
60
50
40
30
20
10
0
0
SCu(cm2)
5
10
15
20
25
30
35
40
Figure 13. Reverse safe operating area
(tp < 1 µs and Tj < 150 °C)
90.0 Iarm (A)
85.0
80.0
75.0
70.0
65.0
60.0 Permitted area
55.0
50.0
80 85 90 95
Forbidden area
Varm (V)
100 105 110 115 120 125 130
Doc ID 018813 Rev 1
5/10
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