25AA160C(2009) View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

25AA160C
(Rev.:2009)

16K SPI Bus Serial EEPROM

Microchip Technology 

25XX160C/D

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

Device

X

–

X

Tape & Reel Temp Range

/XX

Package

Device:

Tape & Reel:

Temperature

Range:

25AA160C

25AA160D

25LC160C

25LC160D

16 Kbit, 1.8V, 16 Byte Page SPI Serial EEPROM

16 Kbit, 1.8V, 32 Byte Page SPI Serial EEPROM

16 Kbit, 2.5V, 16 Byte Page SPI Serial EEPROM

16 Kbit, 2.5V, 32 Byte Page SPI Serial EEPROM

Blank =

T

=

I

=

E

=

Standard packaging

Tape & Reel

-40°C to+85°C

-40°C to+125°C

Examples:

a) 25AA160C-I/MS = 16 Kbit, 16-byte page, 1.8V

Serial EEPROM, Industrial temp., MSOP

package

b) 25AA160CT-I/SN = 16 Kbit, 16-byte page, 1.8V

Serial EEPROM, Industrial temp., Tape & Reel,

SOIC package

c) 25LC160DT-I/SN = 16 Kbit, 32-byte page, 2.5V

Serial EEPROM, Industrial temp., Tape & Reel,

SOIC package

d) 25LC160DT-I/ST = 16 Kbit, 32-byte page, 2.5V

Serial EEPROM, Industrial temp., Tape & Reel,

TSSOP package

Package:

Note 1:

MS =

P

=

SN =

ST =

MNY(1) =

Plastic MSOP (Micro Small Outline), 8-lead

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (3.90 mm body), 8-lead

TSSOP, 8-lead

8-lead 2x3 mm TDFN

“Y” indicates a Nickel Palladium Gold (NiPdAu) finish.

© 2009 Microchip Technology Inc.

DS22150A-page 27

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