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2PC4617XMB View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
2PC4617XMB
NXP
NXP Semiconductors. NXP
2PC4617XMB Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Nexperia
2PC4617xMB series
50 V, 100 mA NPN general-purpose transistors
10. Packing information
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
2PC4617xMB series DFN1006B-3 2 mm pitch, 8 mm tape and reel
(SOT883B)
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Packing quantity
10 000
-315
Footprint information for reflow soldering
SOT883B
1.3
0.7
R0.05 (8x)
0.9
0.25
(2x)
0.3
(2x)
0.3
0.4
(2x)
0.4
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 4. Reflow soldering footprint DFN1006B-3 (SOT883B)
0.6 0.7
sot883b_fr
2PC4617XMB_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 26 March 2012
.
6 of 10
© Nexperia B.V. 2017. All rights reserved

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