MCWL02 View Datasheet(PDF) - Unspecified
Part Name
Description
Manufacturer
MCWL02 Datasheet PDF : 16 Pages
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SMD Wire Wound Chip Inductor
Mechanical Performance Test
Item
Requirement
Vibration
Resistance to Soldering
Heat
Component Adhesion
(Push Test)
Appearance: No damage
L change: within ±5%
Q change: within ±10%
1 lbs. For 0402
2 lbs. For 0603
3 lbs. For the rest
Drop
No damage
Solderability
Resistance to Solvent
90% covered with solder
No damage on appearance
and marking
Test Method
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1 min.
Amplitude: 1.5 mm
Time: 2 hrs for each axis (X, Y & Z), total 6 hrs
Solder Temperature: 260±5°C
Immersion Time: 10±2 seconds
The device should be soldered (260±5 for 10 seconds) to a
tinned copper subs rate. A dynamiter force gauge should be
applied to the side of the component. The device must with
stand a minimum force of 2 or 4 pounds without a failure of
adhesion on termination
Dropping chip by each side and each corner.
Drop 10 times in total
Drop height: 100cm
Drop weight: 125g
Inductor shall be dipped in a melted solder bath at
245±5 for 3 seconds
MIL-STD-202F, Method 215D
Climatic Test
Item
Temperature Characteristic
Humidity
Low Temperature Storage
Thermal Shock
Requirement
Appearance: No damage
L change: within ±10%
Q change: within ±20%
Item
-40 to +125°C
Temperature: 40±2°C
Relative Humidity: 90 to 95% Time: 96±2 hrs
Measured after exposure in the room condition for 2 hrs
Temperature: -40±2°C
Time: 96±2 hrs
Inductors are tested after 1 hour at room temperature
One cycle:
Step
1
Temperature (°C)
-25±3
Time (min.)
30
2
25±2
15
3
125±3
30
4
25±2
15
Total: 5 cycles
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Page <14>
15/09/14 V1.0
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