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TDA9302 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
TDA9302
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TDA9302 Datasheet PDF : 5 Pages
1 2 3 4 5
TDA9302H
Figure 2 : AC Test Circuit
BY252
VS
25V
C1
680mF
C2
220µF
D1
C3
220µF
tfl y
GND
to
Vi
IN
VRE F
R1
12k
2
7
1
R3
63
Iy
V7
5
C4
0.22µF
to
Ly
10mH
4
R7
R6
1.5
330
Ry
R4
5 .9
R2
10k
27k
* Recommended for VRE F filtering
C6
12k
4.7µF
C5
1000µF
R5
1
to
20ms
R5 Iy = 2V
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the HEPTAWATTTM package attaching
the heatsink is very simple, a screw or a compres-
sion spring (clip) being sufficient.
Figure 3 : Mounting Examples
Between the heatsink and the package it is better
to insert a layer of silicon grease, to optimize the
thermal contact ; no electrical isolation is needed
between the two surfaces, since the tab is con-
nected to Pin 4 which is ground.
4/5

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