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TDA8172 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
TDA8172
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TDA8172 Datasheet PDF : 5 Pages
1 2 3 4 5
TDA8172
Figure 2 : AC Test Circuit
1 N4 0 0 1
VS
C1
C2
C3
0.1µF
470µF
D1
220µF
t fly
2
63
VREF
7
Iy
V7
GND
Vi
R1
1
to
1 0k
RT1 4.7k
TDA8 1 7 2
4
5
C4
0.22µF
to
Ly
24.6mH
R7
R6
1 .5
330
Ry
R3
R4
9.6
IN
1 2 k
C6
8 .2 k
R2
4.7µF
C5
5 .6 k
2200µF
R 5 Iy
*Re comme nde d for VREF filtering
R5
to
8.2
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the HEPTAWATTTM package attaching
the heatsink is very simple, a screw or a compres-
sion spring (clip) being sufficient.
Figure 3 : Mounting Examples
Between the heatsink and the package it is better
to insert a layer of silicon grease, to optimize the
thermal contact ; no electrical isolation is needed
between the two surfaces, since the tab is con-
nected to Pin 4 which is ground.
4/5

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