IMB01CGR View Datasheet(PDF) - TE Connectivity
Part Name
Description
Manufacturer
IMB01CGR Datasheet PDF : 4 Pages
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Signal Relays
AXICOM
IM - B RelayTe(rCmonintianluAeds)signment
Relay – top view
Non-Latching Type
dielectric version
Initial dielectric strength
not energizeTTdeOrcPmovniniedawitlioaonsnsrieglanyment
between open contacts
2500Vrms
between contact and coil
3500Vrms
IM-B, 1 form A (NO)
Initial surge withstand voltage
between open contacts
3500V
TerbmetiwnaeleAn scsoigntnamcteanntd coil
4900V
Initial insulation resistance
Reblaeytw–eteonpinvsieuwlated elements
>109Ω
CNaobpnea-tcLwiateatecnnhceion pgeTnycpoentacts m ax. 1pF Latching Type, 1 Coil
nobt eetnweeregnizecodnctaocntdaitnidoncoil
max. 2pF
reset condition
between adjacent contacts
max. 2pF
*this relay contains SF6 (Sulfur hexafluoride, CAS number: 2551-62-4) for dielectric strength
enhancement, SF6 is hermetically sealed in relay without leaks to air during normal applica-
tion as recommended per the applicable product specification. It is clarified that the usage
of SF6 in mini signal relay is not prohibited by related regulations. Please contact TE local
sales or field engineer for further information and detailed material declaration.
Latching Type, 1 Coil
reset condition
Contacts are shown in reset
condition. Contact position might
change during transportation and
must be reset before use.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
RF Data
Isolation at 100MHz/900MHz
Insertion loss at 100MHz/900MHz
Voltage standing wave ratio (VSWR)
at 100MHz/900MHz
37.0dB/18.8dB
0.03dB/0.33dB
1.06/1.49
Dimensions
Other Data
MAllastpeericaifil ccaotmionpsliasunbcjeec:tEtoUcRhaonHgSe./ECLoVn,suClthTinycaoREoleHctSro,nRicEsAfoCr Hla,teHstaslopgeceinficcaotionntes.nt
THT version
Standard version 12 of 28
refer to the Product Compliance Support Center at
www.te.com/customersupport/rohssupportcenter
Ambient temperature
-40°C to +85°C
Thermal resistance
< 150K/W
Category of environmental protection
IEC 61810 RT V - hermetically sealed
Degree of protection
IEC 60529 IP 67, immersion cleanable
Vibration resistance (functional)
20g, 10 to 500Hz
Shock resistance (functional), half sinus 11ms
50g
AXICOMÊSignalAÊRXeIClaOyMs ÊSignalÊRelays
108-98001 Rev. M108-98001 R
Shock resistance (destructive), half sinus 0.5ms 500g
Weight
max. 0.75g
IM-A RelaIyM1-APoRlelaByre1aPko/le1 BFroeramk B/ 1/ FSoPrSmT BNC/ SPST NC
Resistance to soldering heat THT
IEC 60068-2-20
SMT version
265°C/10s DimensionsDIiMm-eAnsions IM-A
Gull wings
Dimensions in mDmimensions in mm
Resistance to soldering heat SMT
IEC 60068-2-58
265°C/10s THT VersionTHT Version
Moisture sensitive level, JEDEC J-Std-020D
MSL3
Ultrasonic cleaning
not recommendedStandard VersiSotnandard Version
SMT VersionSMT Version
Packaging/unit
THT version
SMT version
tube/50pcs., box/1000 pcs.
reel/1000 pcs., box/1000 or 500100.0±p0.0c8s.
0.4
5.4±0.15
IMÊTHT
IMÊTHT
IMÊSMT
IMÊSMT
Standard
Standard
GullÊWings
GullÊWings
mm
6.0±0.1008.0±0.08 L 6.0±100..0080ʱÊ0.08 L
minmch
01.03.9030ʱÊ0.0083
inmcmh
01.309.030Êʱ±ÊÊ00.0.083
mincmh
01.03.9030Êʱ±ÊÊ00..00083
inch
0.393ʱÊ01.000.03±0.08
6.0±0.1008.0±0.08
6.0±0.0
W
6.00ʱÊ0.08 W 06.2.0306Êʱ±ÊÊ00.0.0803
0Ê.2Ê366.0Ê0±Êʱ0Ê.000.038
0Ê.Ê263.60Ê0±Êʱ0Ê.0.0038
0.236ʱÊ0.003
H
5.65ÊÐÊ0.20 H
05.2.6252ÊÊÐÐÊÊ00.2.0008
0Ê.2Ê252.6Ê5ÐÊÊÐ0Ê.000.280
0Ê.Ê252.26Ê5ÐÊÐÊ0Ê.0.0280
0.222ÊÐÊ0.008
T
3.2
T
03.1.225
0.N1/2A5
N/A
N/A
0.4
5.085±.04.±10.15
T1
N/A T1
T2
5.08ʱÊ0.10 T2
D1
D2
5.083±.200.1ʱÊ0.15
2.20ʱÊ0.15
D1
D2
NN//AA
05.2.0080Êʱ±ÊÊ00.1.0004
03.1.2206Êʱ±ÊÊ00.1.0506
02.0.2807Êʱ±ÊÊ00.1.0506
7.50NÊ/±AÊ0.30
0.250.008Êʱ±ÊÊ00.0.1004
0.132.260Êʱ±ÊÊ00.0.1056
0.028.270Êʱ±ÊÊ00.0.1056
07.2.5905ʱÊ0.30011
05.2.080ʱÊ0.1004
03.1.206ʱÊ0.10506
02.0.2807ʱÊ0.10506
0.295ʱÊ00..0411
0.200ʱÊ0.004
0.126ʱÊ50..40±006.15
0.087ʱCÊo0p.la0n0a6rity ≤0.1mm
5.08±00..41
7.5±50.4.3±0.15
Coplanarity ≤0.1mm
5.08±0.
7.5±0.
Tw
0.40 Tw
0.04105
0.01.45
00.0.415
0.015
S
0.75 S
0.07259
0.N0/2A9
N/A
CNo/pAlanarity ≤ 0C.1omplmanarity ≤ 0.1mm
Mounting HoleMLoauynotuintPgCHBolelaLyayoouutt
Solder Pad LaySooultder Pad Layout
TOP view on component side of PCB
View onto the cVoiemwponteonthseidceoomf pthoenePnCtBsid(teopofvtiehwe )PCB (top vieVwie)w onto the cVoiemwponteonthseidceoomf pthoenePnCtBsid(teopofvtiehwe )PCB (top view
THT mounting holes
SMT - solder pads
2
01-2016, Rev. 0116
www.te.com
© 2015 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
Datasheets and product specTifeicrmatiionnal AssigTnemrmenintDaaltAassshiegentms aenndt product data is subject to the Datasheets, product data, ‘Definitions’ sec-
according to IEC 61810-1 anRdetolaybe– utospedvieRwelay –tetrompsvoief wthe disclaimer and all chapters of
tion, application notes and all specifications
only together with the ‘DefinitNioonns’-Lsaetccthioinn.g TNyopne-Lthahttetcph‘:Di/n/ergefilnTayiytpiso.entes.’csoemc/tdioenf,inaitviaoinlasble at
LatchinagreTyspueb,jLe1actCtctohoiilncghaTnygpee., 1 Coil
not energized cnoontdeintieorngized condition
reset conditionreset condition
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