SST25VF016B View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

SST25VF016B

16 Mbit SPI Serial Flash

Microchip Technology 

SST25VF016B

6.0 PACKAGING DIAGRAMS

8-Lead Small Outline Integrated Circuit (S2AE/F) - .208 Inch Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

1.

2.

3.

All linear dimensions are in millimeters (max/min).

Coplanarity: 0.1 mm

Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads.

DS20005044C-page 24

Downloaded from: http://www.datasheetcatalog.com/

Microchip Technology Drawing C04-14005A Sheet 1 of 1

 2015 Microchip Technology Inc.

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