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MT8MTF51264HRZ View Datasheet(PDF) - Micron Technology

Part Name
Description
Manufacturer
MT8MTF51264HRZ
Micron
Micron Technology Micron
MT8MTF51264HRZ Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
4GB (x64, SR) 204-Pin DDR3L-RS SODIMM
Features
Table 2: Addressing
Parameter
Refresh count
Row address
Device bank address
Device configuration
Column address
Module rank address
4GB
8K
64K A[15:0]
8 BA[2:0]
4Gb (512 Meg x 8)
1K A[9:0]
1 S0#
Table 3: Part Numbers and Timing Parameters – 4GB Modules, Standard (Front Side) Layout
Base device: MT41K512M8,1 1.35V 4Gb DDR3L-RS SDRAM
Part Number2
Module
Density
Configuration
MT8MTF51264HSZ-1G6__
4GB
512 Meg x 64
MT8MTF51264HSZ-1G4__
4GB
512 Meg x 64
Module
Bandwidth
12.8 GB/s
10.6 GB/s
Memory Clock/
Data Rate
1.25ns/1600 MT/s
1.5ns/1333 MT/s
Clock Cycles
(CL-tRCD-tRP)
11-11-11
9-9-9
Table 4: Part Numbers and Timing Parameters – 4GB Modules, Reverse (Back Side) Layout
Base device: MT41K512M8,1 1.35V 4Gb DDR3L-RS SDRAM
Part Number2
Module
Density
Configuration
MT8MTF51264HRZ-1G6__
4GB
512 Meg x 64
MT8MTF51264HRZ-1G4__
4GB
512 Meg x 64
Module
Bandwidth
12.8 GB/s
10.6 GB/s
Memory Clock/
Data Rate
1.25ns/1600 MT/s
1.5ns/1333 MT/s
Clock Cycles
(CL-tRCD-tRP)
11-11-11
9-9-9
Notes: 1. The data sheet for the base device can be found on Micron’s web site.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Examples: MT8MTF51264HSZ-1G6E2
PDF: 09005aef84fc0fd3
mtf8c512x64hz_g0_h0.pdf - Rev. D 5/13 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.

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