MC33395 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MC33395

Three-Phase Gate Driver IC

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit

VIGN Supply Voltage

VIGNP Load Dump Survival

VIGN

VIGNPLD

-15.5 to 40

-0.3 to 65

VDC

VDC

VDD Logic Supply Voltage (Fail Safe)

VDD

-0.3 to 7.0

VDC

Logic Input Voltage (LSEn, HSEn, PWM, and MODEn)

VIN

0.3 to 7.0

VDC

Start Up Current VIGNP

ESD Voltage (1)

Human Body Model

Machine Model

IVIGNSTARTUP

100

mA

V

VESD1

VESD2

±500

±200

Storage Temperature

TSTG

-65 to 160

°C

Operating Ambient Temperature

TA

-40 to 125

°C

Operating Case Temperature

TC

-40 to 125

°C

Maximum Junction Temperature

TJ

150

°C

Power Dissipation (TA = 25°C)

Peak Package Reflow Temperature During Reflow (2), (3)

PD

TPPRT

1.5

W

Note 3

°C

Thermal Resistance, Junction-to-Ambient

RΘJA

65

°C/ W

Notes

1. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in

accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

Analog Integrated Circuit Device Data

Freescale Semiconductor

33395

5

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