M24512-DF(2018) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
M24512-DF Datasheet PDF : 40 Pages
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Package information
M24512-W M24512-R M24512-DF
9.5
WLCSP8 ultra thin package information
Figure 21. WLCSP - 8 balls, 1.289x1.955 mm, 1 mm pitch, wafer level chip scale
package outline
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1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
Table 23. WLCSP - 8 balls, 1.289x1.955 mm, 1 mm pitch, wafer level chip scale
mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
0.262
0.295
0.328
0.0103
0.0116
0.0129
A1
-
0.095
-
-
0.0037
-
A2
-
0.175
-
-
0.0069
-
A3
-
0.025
-
-
0.0010
-
b
-
0.185
-
-
0.0073
-
D
-
1.289
1.309
-
0.0507
0.0515
E
-
1.955
1.975
-
0.0770
0.0778
e
-
1.000
-
-
0.0394
-
e1
-
0.866
-
-
0.0341
-
40/47
DS6520 Rev 30
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