RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your CEL Sales Representative.
SOLDERING
METHOD
Infrared Reflow
VPS
WAVE SOLDERING
PARTIAL HEATING
SOLDERING
CONDITIONS
Package Peak Temperature: 230 ˚C or below
Time: 30 seconds or less ( at 210 ˚C)
Count: 3, Exposure limit: None1
Package Peak Temperature: 215 ˚C or below
Time: 40 seconds or less (at 200 ˚C)
Count: 2, Exposure limit: None1
Soldering Bath Temperature: 260 ˚C or below
Time: 10 seconds or less (at 200 ˚C)
Count: 1, Exposure limit: None1
Pin Temperature: 300 ˚C or below
Time: 3 seconds or less (per side of device)
Exposure limit: None1
RECOMMENDED CONDITION
SYMBOL
IR30-00-3
VP15-00-2
WS60-00-1
–
Note:
1. After opening the dry pack, keep it in a place below 25 ˚C and 65% RH for the allowable storage period.
CAUTION:
Do not use different soldering methods together (except for partial heating).
PRECAUTION:
Avoid high static voltage and electric fields.
NE52118
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
DATA SUBJECT TO CHANGE WITHOUT NOTICE
01/24/2000