MX25L6406E
Contents
FEATURES................................................................................................................................................................... 5
GENERAL DESCRIPTION.......................................................................................................................................... 6
PIN CONFIGURATIONS .............................................................................................................................................. 7
PIN DESCRIPTION....................................................................................................................................................... 7
BLOCK DIAGRAM....................................................................................................................................................... 8
MEMORY ORGANIZATION.......................................................................................................................................... 9
Table 1. Memory Organization............................................................................................................................. 9
DEVICE OPERATION................................................................................................................................................. 10
Figure 1. Serial Modes Supported....................................................................................................... 10
DATA PROTECTION.................................................................................................................................................. 11
Table 2. Protected Area Sizes............................................................................................................................. 12
Table 3. 512 bit Secured OTP Definition............................................................................................................ 12
HOLD FEATURES...................................................................................................................................................... 13
Figure 2. Hold Condition Operation ........................................................................................................ 13
COMMAND DESCRIPTION....................................................................................................................................... 14
Table 4. COMMAND DEFINITION...................................................................................................................... 14
(1) Write Enable (WREN).................................................................................................................................... 15
(2) Write Disable (WRDI).................................................................................................................................... 15
(3) Read Status Register (RDSR)....................................................................................................................... 15
(4) Write Status Register (WRSR)...................................................................................................................... 16
Table 5. Protection Modes.................................................................................................................................. 17
(5) Read Data Bytes (READ).............................................................................................................................. 18
(6) Read Data Bytes at Higher Speed (FAST_READ)........................................................................................ 18
(7) Dual Output Mode (DREAD)......................................................................................................................... 18
(8) Sector Erase (SE).......................................................................................................................................... 18
(9) Block Erase (BE)........................................................................................................................................... 19
(10) Chip Erase (CE).......................................................................................................................................... 19
(11) Page Program (PP)..................................................................................................................................... 19
(12) Deep Power-down (DP)............................................................................................................................... 20
(13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) .............................................. 20
(14) Read Identification (RDID)........................................................................................................................... 21
(15) Read Electronic Manufacturer ID & Device ID (REMS)............................................................................... 21
Table 6. ID DEFINITIONS .................................................................................................................................. 22
(16) Enter Secured OTP (ENSO)........................................................................................................................ 22
(17) Exit Secured OTP (EXSO).......................................................................................................................... 22
(18) Read Security Register (RDSCUR)............................................................................................................. 23
Table 7. SECURITY REGISTER DEFINITION................................................................................................... 23
(19) Write Security Register (WRSCUR)............................................................................................................ 23
P/N: PM1577
REV. 1.1, NOV. 17, 2010
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