MPXA6115AC6U(2009) View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MPXA6115AC6U
(Rev.:2009)
(Rev.:2009)
Freescale Semiconductor
MPXA6115AC6U Datasheet PDF : 17 Pages
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On-chip Temperature Compensation and Calibration
Pressure
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0° to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
Fluorosilicone
Gel Die Coat
P1
Wire Bond
Lead
Frame
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXxx6115A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Stainless
Die
Steel Cap
Thermoplastic
Case
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale)
+5.0 V
100 nF
VS Pin 2
MPXxx6115A
Vout Pin 4
GND Pin 3
to ADC
47 pF
51 K
Sensors
Freescale Semiconductor
Figure 3. Typical Application Circuit
(Output Source Current Operation)
5.0
4.5
Transfer Function:
Vout = Vs* (.009*P-.095) ± Error
MAX
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85ºC
TYP
3.0
2.5
2.0
1.5
1.0
MIN
0.5
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output vs. Absolute Pressure
MPXA6115A
5
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