B32928C3306M289 View Datasheet(PDF) - TDK Corporation

Part Name

Description

Manufacturer

B32928C3306M289

Film Capacitors EMI Suppression Capacitors (MKP)

TDK Corporation 

B32921C/D ... B32928C/D

X2 / 305 V AC

Mounting guidelines

1

Soldering

1.1 Solderability of leads

The solderability of terminal leads is tested to IEC 60068-2-20:2008, test Ta, method 1.

Before a solderability test is carried out, terminals are subjected to accelerated ageing (to

IEC 60068-2-2:2007, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature

is far higher than the upper category temperature of the capacitors, the terminal wires should be

cut off from the capacitor before the ageing procedure to prevent the solderability being impaired

by the products of any capacitor decomposition that might occur.

Solder bath temperature

Soldering time

Immersion depth

Evaluation criteria:

Visual inspection

235 ±5 °C

2.0 ±0.5 s

2.0 +0/0.5 mm from capacitor body or seating plane

Wetting of wire surface by new solder ≥90%,

free-flowing solder

1.2 Resistance to soldering heat

Resistance to soldering heat is tested to IEC 60068-2-20:2008, test Tb, method 1.

Conditions:

Series

Solder bath temperature Soldering time

MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ±5 °C

10 ±1 s

coated

uncoated (lead spacing >10 mm)

MFP

MKP (lead spacing >7.5 mm)

MKT boxed (case 2.5 × 6.5 × 7.2 mm)

5 ±1 s

MKP (lead spacing ≤7.5 mm)

MKT uncoated (lead spacing ≤10 mm)

<4 s

recommended soldering

insulated (B32559)

profile for MKT uncoated

(lead spacing ≤ 10 mm) and

insulated (B32559)

Please read Cautions and warnings and

Important notes at the end of this document.

Page 16 of 27

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