RP73PF1J100KBTDF View Datasheet(PDF) - TE Connectivity
Part Name
Description
Manufacturer
RP73PF1J100KBTDF Datasheet PDF : 11 Pages
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SMD High Power Precision Resistors
Construction and dimensions
L
D1
W
T
D2
Alumina Substrate
Bottom Electrode (Ag)
Top Electrode ( Ag)
Edge Electrode (NiCr)
Barrier Layer (Ni)
External Electrode (Sn)
Resistor Layer (NiCr)
Overcoat (Epoxy)
Marking
Size
0402
0603
0805
1206
1210
2010
2512
L (mm)
1.00±0.05
1.55±0.10
2.00±0.15
3.05±0.15
3.10±0.15
4.90±0.15
6.30±0.15
W (mm)
0.50±0.05
0.80±0.10
1.25±0.15
1.55±0.15
2.40±0.15
2.40±0.15
3.10±0.15
T (mm)
0.30±0.05
0.45±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.55±0.10
D1 (mm)
0.20±0.10
0.30±0.20
0.30±0.20
0.42±0.20
0.40±0.20
0.60±0.30
0.60±0.30
D2 (mm)
0.20±0.10
0.30±0.20
0.40±0.20
0.35±0.25
0.55±0.25
0.50±0.25
0.50±0.25
Weight (g)
(1000 Pcs.)
0.54
1.83
4.71
9.02
10
23.61
38.06
Suggested PCB Layout Plan
Size
0402
0603
0805
1206
1210
2010
2512
Recommended Land Pattern
A
B
0.50
0.50
0.80
1.00
1.00
1.00
2.00
1.15
2.00
1.15
3.60
1.40
4.90
1.60
C
0.60±0.2
0.90±0.2
1.35±0.2
1.70±0.2
2.50±0.2
2.50±0.2
3.10±0.2
1773272 CIS WR 09/2015
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
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