List of figures
STM32L151xC STM32L152xC
Figure 46.
Figure 47.
Figure 48.
Figure 49.
Figure 50.
UFBGA100, 7 x 7 mm, 0.5 mm pitch, package top view example . . . . . . . . . . . . . . . . . . 124
WLCSP63, 0.400 mm pitch wafer level chip size package outline . . . . . . . . . . . . . . . . . . 125
WLCSP63 device marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Thermal resistance suffix 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Thermal resistance suffix 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
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DocID022799 Rev 13