TEMT6200FX01(2007) View Datasheet(PDF) - Vishay Semiconductors
Part Name
Description
Manufacturer
TEMT6200FX01
(Rev.:2007)
(Rev.:2007)
Vishay Semiconductors
TEMT6200FX01 Datasheet PDF : 8 Pages
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TEMT6200FX01
Vishay Semiconductors
0° 10° 20°
30°
40°
1.0
0.9
50°
0.8
60°
0.7
70°
80°
0.6 0.4 0.2
94 8318
0 0.2 0.4 0.6
Figure 8. Relative Radiant Sensitivity vs. Angular Displacement
Reflow Solder Profiles
280
260
240
220
200
180
160
140
120 125 °C
100
80
60
40
20
0
0 30
19030
Preheat
Reflow
Cooling
260 °C
250 °C
210 °C
145 °C
120 s
~ 20 s
~ 30 s
~ 40 s
60 90 120 150 180 210 240 270 300
Time (s)
Figure 9. Lead (Pb)-free (Sn) Reflow Solder Profile
300
max. 240 °C ca. 230 °C
250
10 s
948625
200
150
100
50
0
0
215 °C
max. 160 °C
max 40 s
90 s to 120 s
Lead Temperature
2 K/s to 4 K/s
Full Line: Typical
Dotted: Process Limits
50
100
150
200
250
Time (s)
Figure 10. Lead Tin (SnPb) Reflow Solder Profile
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a
desiccant.
Floor Life
Time between soldering and removing from MBB
must not exceed the time indicated in J-STD-020,
Moisture sensitivity level 4:
Floor life: 72 h
Conditions: Tamb < 30 °C, RH < 60 %
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (+ 5 °C), RH < 5 %.
www.vishay.com
4
Document Number 81317
Rev. 1.3, 29-Aug-07
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