LPC1311FHN33 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
LPC1311FHN33
NXP Semiconductors.
LPC1311FHN33 Datasheet PDF : 74 Pages
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NXP Semiconductors
LPC1311/13/42/43
32-bit ARM Cortex-M3 microcontroller
Table 21. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation Crystal load
frequency FOSC
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
1 MHz - 5 MHz
10 pF
< 300 Ω
18 pF, 18 pF
20 pF
< 300 Ω
39 pF, 39 pF
30 pF
< 300 Ω
57 pF, 57 pF
5 MHz - 10 MHz
10 pF
< 300 Ω
18 pF, 18 pF
20 pF
< 200 Ω
39 pF, 39 pF
30 pF
< 100 Ω
57 pF, 57 pF
10 MHz - 15 MHz
10 pF
< 160 Ω
18 pF, 18 pF
20 pF
< 60 Ω
39 pF, 39 pF
15 MHz - 20 MHz
10 pF
< 80 Ω
18 pF, 18 pF
Table 22. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation
frequency FOSC
15 MHz - 20 MHz
Crystal load
capacitance CL
10 pF
Maximum crystal
series resistance RS
< 180 Ω
External load
capacitors CX1, CX2
18 pF, 18 pF
20 pF
< 100 Ω
39 pF, 39 pF
20 MHz - 25 MHz
10 pF
< 160 Ω
18 pF, 18 pF
20 pF
< 80 Ω
39 pF, 39 pF
11.3 XTAL Printed-Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
LPC1311_13_42_43
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 6 June 2012
© NXP B.V. 2012. All rights reserved.
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