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LTC4440-5 View Datasheet(PDF) - Linear Technology

Part Name
Description
Manufacturer
LTC4440-5 Datasheet PDF : 12 Pages
First Prev 11 12
LTC4440-5
PACKAGE DESCRIPTION
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
5.23
(.206)
MIN
2.083 ± 0.102 3.20 – 3.45
(.082 ± .004) (.126 – .136)
0.254
(.010)
DETAIL “A”
0° – 6° TYP
4.90 ± 0.152
(.193 ± .006)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
GAUGE
PLANE
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
1 234
1.10
(.043)
MAX
SEATING
NOTE:
PLANE
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
0.52
(.0205)
1
REF
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
2.06 ± 0.102
(.081 ± .004)
1.83 ± 0.102
(.072 ± .004)
0.86
(.034)
REF
8
BOTTOM VIEW OF
EXPOSED PAD OPTION
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8E) 0603
0.62
0.95
MAX
REF
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
2.90 BSC
(NOTE 4)
1.22 REF
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC 1.50 – 1.75
(NOTE 4)
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.95 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
1.90 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
0.01 – 0.10
S6 TSOT-23 0302 REV B
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
44405fa
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