LTC4440-5 View Datasheet(PDF) - Linear Technology
Part Name
Description
Manufacturer
LTC4440-5 Datasheet PDF : 12 Pages
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TYPICAL PERFOR A CE CHARACTERISTICS
LTC4440-5
Output Driver Pull-Down
Resistance vs Temperature
3.0
2.5
BOOST-TS = 4V
BOOST-TS = 6V
2.0
1.5
BOOST-TS = 15V
BOOST-TS = 12V
1.0
0.5
0
–55 –35 –15 5 25 45 65 85 105 125
TEMPERATURE (°C)
4440-5 G14
Propagation Delay vs Temperature
50
VCC = BOOST = 6V
45
40
tPLH
35
tPHL
30
25
20
–55 –35 –15 5 25 45 65 85 105 125
TEMPERATURE (°C)
4440-5 G15
Driving a 3300pF Capacitive Load
Driving a 3300pF Capacitive Load
TG-TS
2V/DIV
TG-TS
5V/DIV
INP
2V/DIV
50ns/DIV
VCC = BOOST-TS = 5V
4440-5 G16
INP
2V/DIV
50ns/DIV
VCC = BOOST-TS = 12V
4440-5 G17
PI FU CTIO S
SOT-23 Package
VCC (Pin 1): Chip Supply. This pin powers the internal low
side circuitry. A low ESR ceramic bypass capacitor should
be tied between this pin and the GND pin (Pin 2).
GND (Pin 2): Chip Ground.
INP (Pin 3): Input Signal. TTL/CMOS compatible input
referenced to GND (Pin 2).
TS (Pin 4): Top (High Side) source connection or GND if
used in ground referenced applications.
TG (Pin 5): High Current Gate Driver Output (Top Gate).
This pin swings between TS and BOOST.
BOOST (Pin 6): High Side Bootstrapped Supply. An exter-
nal capacitor should be tied between this pin and TS
(Pin 4). Normally, a bootstrap diode is connected between
VCC (Pin 1) and this pin. Voltage swing at this pin is from
VCC – VD to VIN + VCC – VD, where VD is the forward voltage
drop of the bootstrap diode.
44405fa
5
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