MAC7101CAF50 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MAC7101CAF50

Microcontroller Family Hardware Specifications

Freescale Semiconductor 

Electrical Characteristics

3.6.1 Thermal Resistance Simulation Details

Table 11. Thermal Resistance for Case Outline 983–02, 100 Lead 14x14 mm LQFP, 0.5 mm Pitch

Rating

Junction to Ambient (Natural Convection)

Junction to Ambient (Natural Convection)

Junction to Ambient (@ 200 ft./min.)

Junction to Ambient (@ 200 ft./min.)

Junction to Board

Junction to Case

Junction to Package Top

Environment

Single layer board (1s)

Four layer board (2s2p)

Single layer board (1s)

Four layer board (2s2p)

Natural Convection

Symbol

RθJA

RθJMA

RθJMA

RθJMA

RθJB

RθJC

ΨJT

Value

44

34

37

29

18

7

2

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Comments

1, 2

1, 3

1, 3

1, 3

4

5

6

Table 12. Thermal Resistance for Case Outline 987–01, 112 Lead 20x20 mm LQFP, 0.65 mm Pitch

Rating

Junction to Ambient (Natural Convection)

Junction to Ambient (Natural Convection)

Junction to Ambient (@ 200 ft./min.)

Junction to Ambient (@ 200 ft./min.)

Junction to Board

Junction to Case

Junction to Package Top

Environment

Single layer board (1s)

Four layer board (2s2p)

Single layer board (1s)

Four layer board (2s2p)

Natural Convection

Symbol

RθJA

RθJMA

RθJMA

RθJMA

RθJB

RθJC

ΨJT

Value

42

34

35

30

22

7

2

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Comments

1, 2

1, 3

1, 3

1, 3

4

5

6

Table 13. Thermal Resistance for Case Outline 918–03, 144 Lead 20x20 mm LQFP, 0.5 mm Pitch

Rating

Junction to Ambient (Natural Convection)

Junction to Ambient (Natural Convection)

Junction to Ambient (@ 200 ft./min.)

Junction to Ambient (@ 200 ft./min.)

Junction to Board

Junction to Case

Junction to Package Top

Environment

Single layer board (1s)

Four layer board (2s2p)

Single layer board (1s)

Four layer board (2s2p)

Natural Convection

Symbol

RθJA

RθJMA

RθJMA

RθJMA

RθJB

RθJC

ΨJT

Value

42

34

35

30

22

7

2

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Comments

1, 2

1, 3

1, 3

1, 3

4

5

6

Table 14. Thermal Resistance for Case Outline 1159A-01, 208 Lead 17x17 mm MAP BGA, 1.0 mm Pitch

Rating

Environment

Symbol Value Unit Comments

Junction to Ambient (Natural Convection)

Junction to Ambient (Natural Convection)

Junction to Ambient (@ 200 ft./min.)

Junction to Ambient (@ 200 ft./min.)

Junction to Board

Junction to Case

Junction to Package Top

Single layer board (1s)

Four layer board (2s2p)

Single layer board (1s)

Four layer board (2s2p)

Natural Convection

RθJA

46

°C/W

1, 2

RθJMA

29

°C/W

1, 3

RθJMA

38

°C/W

1, 3

RθJMA

26

°C/W

1, 3

RθJB

19

°C/W

4

RθJC

7

°C/W

5

ΨJT

2

°C/W

6

Comments:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface

of the board at the center lead. For fused lead packages, the adjacent lead is used.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC

JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

MAC7100 Microcontroller Family Hardware Specifications, Rev. 1.2

10

Preliminary

Freescale Semiconductor

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