MAC7101MVM50 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MAC7101MVM50

Microcontroller Family Hardware Specifications

Freescale Semiconductor 

Electrical Characteristics

Note that the JEDEC specification reserves the symbol RθJA or θJA (Theta-JA) strictly for junction-to-

ambient thermal resistance on a 1s test board in natural convection environment. RθJMA or θJMA

(Theta-JMA) will be used for both junction-to-ambient on a 2s2p test board in natural convection and for

junction-to-ambient with forced convection on both 1s and 2s2p test boards. It is anticipated that the

generic name, θJA, will continue to be commonly used.

The average chip-junction temperature (TJ) in °C is obtained from the formula:

TJ = TA + PD ⋅ ΘJA

where

TJ = Junction Temperature (°C)

TA = Ambient Temperature (°C)

PD = Total Chip Power Dissipation (W)

ΘJA = Package Thermal Resistance (°C/W)

The total power dissipation is calculated as:

Eqn. 1

PD = PINT + PIO

where

PINT = Chip Internal Power Dissipation (W)

PIO = Input / Output Power Dissipation (W)

Two cases must be considered for PINT:

1. Internal voltage regulator enabled:

Eqn. 2

PINT = (IDDR × VDDR) + (IDDA × VDDA)

2. Internal voltage regulator disabled (VDDR = VSSR = system ground):

PINT = (IDD2.5 × VDD2.5) + (IDDPLL × VDDPLL) + (IDDA × VDDA)

PIO is the sum of all output currents on input/output pins associated with VDDX:

∑ PIO =

RDSON ⋅ (IIOi)2

where

i

RDSON = V--I--O-O--L-L- (for outputs driven low)

or

RDSON = V-----D---D---X-I--O---–L----V----O----H- (for outputs driven high)

Table 10. Thermal Resistance 1/8 Simulation Model Packaging Parameters

Component

Mold Compound

Leadframe (Copper)

Die Attach

Conductivity

0.9 W/m K

263 W/m K

1.7 W/m K

Eqn. 3

Eqn. 4

Eqn. 5

Eqn. 6

Eqn. 7

MAC7100 Microcontroller Family Hardware Specifications, Rev. 1.2

Freescale Semiconductor

Preliminary

9

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