ML12011-5P View Datasheet(PDF) - LANSDALE Semiconductor Inc.
Part Name
Description
Manufacturer
ML12011-5P Datasheet PDF : 14 Pages
| |||
ML12009, ML12011
LANSDALE Semiconductor, Inc.
–A–
16
1
OUTLINE DIMENSIONS
SO 16 = -5P
PLASTIC PACKAGE
(ML12009-5P, ML12011-5P)
CASE 751B–05
(SO–16)
9
ISSUE J
–B– P 8 PL
8
0.25 (0.010) M B S
G
–T– SEATING
PLANE
K
C
D 16 PL
0.25 (0.010) M T B S A S
F
R X 45
M
J
–A–
16
1
H
G
9
B
8
P DIP 16 = EP
PLASTIC PACKAGE
(ML12009EP, ML12011EP)
CASE 648–08
ISSUE R
F
C
L
S
–T–
SEATING
PLANE
K
J
M
D 16 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G
1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M
0
7
0
7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
DIM MIN MAX
A 0.740 0.770
B 0.250 0.270
C 0.145 0.175
D 0.015 0.021
F 0.040 0.70
G 0.100 BSC
H 0.050 BSC
J 0.008 0.015
K 0.110 0.130
L 0.295 0.305
M
0
10
S 0.020 0.040
MILLIMETERS
MIN MAX
18.80 19.55
6.35 6.85
3.69 4.44
0.39 0.53
1.02 1.77
2.54 BSC
1.27 BSC
0.21 0.38
2.80 3.30
7.50 7.74
0
10
0.51 1.01
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
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