µPC79M00 Series
RECOMMENDED SOLDERING CONDITIONS
When soldering these products, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Type of Through-hole Devices
µPC79M05HF, 79M08HF, 79M12HF, 79M15HF, 79M18HF, 79M24HF: 3-pin plastic SIP (MP-45G)
Process
Wave soldering
(only to leads)
Conditions
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
REFERENCE DOCUMENTS
Quality Grades on NEC Semiconductor Devices
Semiconductor Device Mounting Technology Manual
IC Package Manual
Guide to Quality Assurance for Semiconductor Devices
Semiconductors Selection Guide
NEC Semiconductor Device Reliability/Quality Control System
-Three Terminal Regulator
C11531E
C10535E
C10943X
MEI-1202
X10679E
IEI-1212
9