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RL56CSM-3 View Datasheet(PDF) - Conexant Systems

Part Name
Description
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RL56CSM-3 Datasheet PDF : 66 Pages
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RL56CSMV/3 and RL56CSM/3 Hardware Interface Description
Table of Contents
1137
1. INTRODUCTION................................................................................................................................................. 1-1
1.1 SUMMARY ............................................................................................................................................... 1-1
1.2 FEATURES .............................................................................................................................................. 1-2
1.3 TECHNICAL OVERVIEW......................................................................................................................... 1-3
1.3.1 General Description ..................................................................................................................... 1-3
1.3.2 Digital Data Pump (DDP) ............................................................................................................. 1-3
1.3.3 ARM Microcontroller (MCU)......................................................................................................... 1-3
1.3.4 Access Processor Operation ....................................................................................................... 1-3
1.3.5 Access Processor Firmware ........................................................................................................ 1-3
1.3.6 Supported Interfaces ................................................................................................................... 1-5
2. TECHNICAL SPECIFICATIONS ........................................................................................................................ 2-1
2.1 ESTABLISHING DATA MODEM CONNECTIONS................................................................................... 2-1
2.2 DATA MODE ............................................................................................................................................ 2-1
2.3 ERROR CORRECTION AND DATA COMPRESSION............................................................................. 2-2
2.4 FAX OPERATION .................................................................................................................................... 2-2
2.5 DIAGNOSTICS......................................................................................................................................... 2-2
2.5.1 Commanded Tests....................................................................................................................... 2-2
2.5.2 DDP Test ..................................................................................................................................... 2-3
2.6 LOW POWER SLEEP MODE................................................................................................................... 2-3
3. HARDWARE INTERFACE ................................................................................................................................. 3-1
3.1 HARDWARE SIGNALS ............................................................................................................................ 3-1
3.2 ELECTRICAL AND ENVIRONMENTAL SPECIFICATIONS .................................................................. 3-15
3.2.1 Operating Conditions and Absolute Maximum Ratings ............................................................. 3-15
3.2.2 Current and Power Requirements ............................................................................................. 3-15
3.2.3 Thermal Characteristics ............................................................................................................. 3-17
3.3 INTERFACE TIMING AND WAVEFORMS............................................................................................. 3-19
3.3.1 External SDRAM........................................................................................................................ 3-19
3.3.2 T1/E1 Transceiver Interface Timing........................................................................................... 3-20
3.3.3 Oscillator Waveform Requirements ........................................................................................... 3-21
3.4 SDRAM INTERFACE CONNECTIONS .................................................................................................. 3-22
3.4.1 16-Mbit SDRAM Interface .......................................................................................................... 3-22
3.4.2 64-Mbit SDRAM Interface .......................................................................................................... 3-23
4. HOST INTERFACE............................................................................................................................................. 4-1
4.1 REGISTERS AND FIFO ........................................................................................................................... 4-1
4.2 HOST INTERFACE DESCRIPTION......................................................................................................... 4-3
4.2.1 Mailbox Interface ......................................................................................................................... 4-4
4.2.2 Host FIFO Interface ..................................................................................................................... 4-4
4.2.3 Host Bus Timing .......................................................................................................................... 4-7
4.2.4 Host Interface - DMA Demand Mode Timing ............................................................................... 4-9
4.2.5 Host Interface Pin Summary ...................................................................................................... 4-11
5. DESIGN CONSIDERATIONS ............................................................................................................................. 5-1
5.1 PC BOARD LAYOUT GUIDELINES......................................................................................................... 5-1
5.1.1 General Principles ....................................................................................................................... 5-1
5.1.2 Component Placement ................................................................................................................ 5-1
5.1.3 Signal Routing ............................................................................................................................. 5-1
5.1.4 Power........................................................................................................................................... 5-2
5.1.5 Ground Planes ............................................................................................................................. 5-2
5.1.6 Clock Oscillator Circuit................................................................................................................. 5-2
5.1.7 EMI Considerations for Standalone Modem Design .................................................................... 5-3
5.1.8 Optional Configurations ............................................................................................................... 5-3
5.1.9 DDP Specific................................................................................................................................ 5-3
Conexant
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