LPC47N217-JN View Datasheet(PDF) - SMSC -> Microchip
Part Name
Description
Manufacturer
LPC47N217-JN Datasheet PDF : 5 Pages
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Package Outline
Figure 2 - 64 Pin STQFP Package Outline, 7x7x1.4 Body, 2 MM Footprint
Table 1 - 64 Pin STQFP Package Parameters
MIN
NOMINAL
MAX
A
~
~
1.60
A1
0.05
~
0.15
A2
1.35
1.40
1.45
D
8.80
9.00
9.20
D1
6.80
7.00
7.20
E
8.80
9.00
9.20
E1
6.80
7.00
7.20
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00 REF.
~
e
0.40 Basic
θ
0o
~
7o
W
0.13
0.18
0.23
ccc
~
~
0.08
REMARKS
Overall Package Height
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.035 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane H.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC LPC47N217
Page 5
PRODUCT PREVIEW
Revision 06-10-03
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