AD9694 View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD9694 Datasheet PDF : 101 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Electrical
AVDD1 to AGND
AVDD1_SR to AGND
AVDD2 to AGND
AVDD3 to AGND
DVDD to DGND
DRVDD1 to DRGND
DRVDD2 to DRGND
SPIVDD to AGND
VIN±x to AGND
CLK± to AGND
SCLK, SDIO, CSB to DGND
PDWN/STBY to DGND
SYSREF± to AGND_SR
SYNCINB±AB/SYNCINB±CD to
DRGND
Environmental
Operating Junction Temperature
Range
Maximum Junction Temperature
Storage Temperature Range
(Ambient)
Rating
1.05 V
1.05 V
2.00 V
2.70 V
1.05 V
1.05 V
2.00 V
2.00 V
−0.3 V to AVDD3 + 0.3 V
−0.3 V to AVDD1 + 0.3 V
−0.3 V to SPIVDD + 0.3 V
−0.3 V to SPIVDD + 0.3 V
0 V to 2.5 V
0 V to 2.5 V
−40°C to +105°C
125°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
AD9694
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θJC_BOT is the bottom junction to case thermal resistance.
Table 9. Thermal Resistance
PCB Type Airflow Velocity (m/sec)
JEDEC
0.0
2s2p Board 1.0
2.5
10-Layer
0.0
Board
θJA
21.581, 2
17.941, 2
16.581, 2
9.74
θJC_BOT
1.951, 5
N/A4
N/A4
1.00
Unit
°C/W
°C/W
°C/W
°C/W
1 Per JEDEC 51-7, plus JEDEC 51-5 2s2p test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per JEDEC JESD51-8 (still air).
4 N/A means not applicable.
5 Per MIL-STD 883, Method 1012.1.
ESD CAUTION
Rev. 0 | Page 11 of 101
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