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Part Name
Description
A9213-A-W0 View Datasheet(PDF) - AMIC Technology
Part Name
Description
Manufacturer
A9213-A-W0
ISO/IEC 14443A RFID TAG IC
AMIC Technology
A9213-A-W0 Datasheet PDF : 12 Pages
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Rev 1.0
11. Gold Bump Specification
A9213-A
ISO/IEC 14443A RFID TAG IC
․
Bump material:
․
Bump hardness:
․
Bump shear strength:
․
Bump height:
>99.9% pure Au
35 – 80 HV 0.005
>70MPa
18
u
m
․
Bump height uniformly:
–
Within a die
–
Within a wafer
–
Wafer to wafer
․
Bump flatness:
±
2
u
m
±
3
u
m
±
4
u
m
±
1.5
u
m
․
Bump size:
–
ANTP, ANTM:
80um x 80um;
–
TIO0 TIO1, TIO2:
60um x 60um
–
Variation:
±
5
u
m
․
Under bump metallization:
Sputtered TiW
p
10 of 12
Ver. 1.0
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